Etek Aero, Prestwick Aerospace Centre


High energy. High resolution. High versatility.

Small parts or large parts, the optional combination of two X-ray tubes with a spacious flat-panel detector (DDA – digital detector array) and a linear detector array (LDA) caters to the broadest application range. While the mini-focus tube, with its high energy of up to 600 kV, is the right solution for large and dense parts, the directional micro-focus tube (up to 300 kV) provides detailed insights into the inner structures of small components. Seamless switches between 2D radioscopy, 3D cone-beam, and fan-beam CT provide outstanding flexibility and the creation of individual inspection processes.

Comet Yxlon logo

With its dual-tube configuration, the high-energy, high-resolution FF85 CT achieves extremely precise inspection results for a wide variety of material types and part sizes.

Coment Yxlon FF85 Computed Tomography inspection system Aerospace


FF series

Automotive, Aerospace, Science & research, Welds, Foundries, Add. manufacturing

Defect size:
<1mm Defect, >1mm Defect

Part Size:
Small Size, Medium Size, Large Size

Mode of operation:
3D, 2D/3D

FF85 CT highlights

Extensive range of applications from microCT to high-energy CT due to dual tube configuration and both flat-panel and line detector

Large inspection envelope by diverse field-of-view extensions, helical and dual-helical CT techniques

Granite base for temperature stability and precise manipulation

Maximum versatility through up to 7 manipulation axes

Intuitive Geminy user interface with touchscreens for easy system operation

Which items can be inspected with the FF85 CT?

Aluminum, steel, and super alloy components

Additively manufactured parts

Battery cells, modules, and systems

Fiber-reinforced composites

Plastic injection molded parts

Cultural assets, historical art, and archeological objects

Geological, paleontological and biological samples

Mechatronic modules

Which applications is the FF85 CT designed for?

Material and structural analysis in research and development

First article inspection

Dimensional measurement

Small series inspection

Failure analysis

Assembly checks




Comet Yxlon CTScan 3 line detector array

Comet Yxlon developed the CTScan 3 line detector array (LDA) for customers’ special requirements and challenging applications. With its unprecedented signal-to-noise ratio, its dynamic range, and a pixel pitch of 254 μm, it is the no-alternative solution for the crystal-clear inspection of large and/or dense components. It is designed for up to 600 kV operation reducing unwanted scatter radiation and providing low-noise electronics and highly efficient scintillators.

Almost indestructible: the granite-based manipulator

Another building block that contributes to the premium performance of FF85 CT is the rock-solid granite-based manipulator. It makes the system extremely precise and durable by providing warp resistance and temperature stability.

Various trajectories for maximum flexibility

Graphic symbols and a wide range of automated functions, displayed on the intuitive user interface Geminy make operation easy – regardless of the operator’s skill level. At the same time, it offers a great number of features for flexibility regarding part sizes and inspection tasks, like CT trajectories such as HeliExtend (helical CT scan and reconstruction method), horizontal and vertical field-of-view extensions, a virtual rotation axis, and standard quick/quality scans. Image enhancement tools like ScatterFix 2.0, beam hardening reduction (BHC), or metal artifact reduction (MAR) reduce or eliminate scattered radiation or artifacts in the image.

Technical Data

AttributeRespective Value
Sample Size800 x 500 [mm] (31'' x 19'')
Max. Radiographic Area 460 x 410 [mm] (18'' x 16'')
System Dimensions (W/D/H)1650 x 1400 x 2050 [mm]
System Weight2200 kg
FeinFocus X-ray TubeFXT-160.50 Microfocus or FXT-160.51 Multifocus, 20 - 160 kV voltage range
Detector Active Area1004 x 620 px (Y.Panel 1308), 1004 x 1004 px (Y.Panel 1313), 1276 x 1276 px (ORYX 1616)
Pixel Pitch127 µm
Bit Depth16 bit
Oblique Viewing+/- 70° (140°)
3D ModesLaminography (micro3Dslice), CT Quick Scan, Quality Scan